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product family data sheet copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. CLD-DS34 rev 4 cree ? xlamp ? xp-e high-effciency white leds product description xlamp xp-e high-effciency white le ds upgrade the xlamp xp-e to leading performance levels for diffuse lighting applications. xp-e hew is designed to enable faster adoption of l e d light in cost-sensitive, consumer lighting products. compared to the standard xlamp xp-e, xp-e hew can reduce le d count by 50% and still deliver the same system performance. cree xlamp l e ds bring high performance and quality of light to a wide range of lighting applications, including color-changing, portable and personal, outdoor, indoor- directional, transportation, stage and studio, commercial and emergency-vehicle lighting. features ? light output and effcacy similar to xlamp xp-g ? maximum drive current: 1000 ma ? low thermal resistance: 6 c/w ? maximum junction temperature: 150 c ? wide viewing angle: 120 ? refow solderable - jedec j-std-020c compatible ? e lectrically neutral thermal path ? rohs- and r each-compliant ? ul - recognized component (e349212) table of contents www .cree.com/xlamp cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 flux characteristics ................... 2 characteristics ......................... 3 relative spectral power distribution .............................. 3 relative flux vs. junction temperature ............................ 4 e lectrical characteristics ............ 5 relative flux vs. current ........... 5 relative chromaticity vs. current ................................... 6 relative chromaticity vs. temperature ............................ 6 typical spatial distribution ......... 7 thermal design ........................ 7 refow soldering characteristics . 8 notes ...................................... 9 mechanical dimensions ............ 11 tape and reel ........................ 12 packaging .............................. 13
2 flux characteristics (t j = 25 c) - white the following table provides several base order codes for xlamp xp-e hew leds. it is important to note that the base order codes listed here are a subset of the total available order codes for the product family. for more order codes, as well as a complete description of the order-code nomenclature, please consult the xlamp xp family binning and labeling document. color cct range base order codes min. luminous flux @ 350 ma order code min. max. group flux (lm) cool white 5000 k 8300 k r3 122 xpehew-l1-0000-00f51 r4 130 xpehew-l1-0000-00g51 outdoor white 2600 k 5300 k r2 114 xpehew-01-0000-00ec2 r3 122 xpehew-01-0000-00fc2 neutral white 3700 k 5000 k q5 107 xpehew-l1-0000-00de4 r2 114 xpehew-l1-0000-00ee4 80-cri white 2600 k 4300 k q3 93.9 xpehew-h1-0000-00be7 q4 100 xpehew-h1-0000-00ce7 warm white 2600 k 3700 k q3 93.9 xpehew-l1-0000-00be7 q4 100 xpehew-l1-0000-00ce7 85-cri white 2600 k 3200 k p4 80.6 xpehew-p1-0000-009e7 q2 87.4 xpehew-p1-0000-00 ae7 90-cri white 2600 k 3200 k p4 80.6 xpehew-u1-0000-009e7 notes: ? cree maintains a tolerance of 7% on fux and power measurements , 0.005 on chromaticity (ccx, ccy) measurements and 2 on cri measurements. ? typical cri for cool white (5000 k - 8300 k cct) is 68. ? typical cri for neutral white (3,700 k - 5000 k cct) is 75. ? typical cri for outdoor white (2600 k - 5300 k cct) is 70. ? typical cri for warm white (2600 k - 3700 k cct) is 80. ? minimum cri for 80-cri white is 80. ? minimum cri for 85-cri white is 85. ? minimum cri for 90-cri white is 90. 2 copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
3 characteristics characteristics unit minimum typical maximum thermal resistance, junction to solder point - white c/w 6 viewing angle (fwhm) - white degrees 120 temperature coeffcient of voltage - white mv/c -3 esd classifcation (hbm per m il-std-883d) class 2 dc forward current - white ma 1000 reverse voltage v 5 forward voltage (@ 350 ma) - white v 3.0 3.5 forward voltage (@ 700 ma) - white v 3.15 forward voltage (@ 1000 ma) - white v 3.25 le d junction temperature c 150 relative spectral power distribution 3 relative spectral power 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) cool white neutral white warm & 80 cri white copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
4 relative spectral power distribution (continued) relative flux vs. junction temperature (i f = 350 ma) 4 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) outdoor white 85 & 90 cri white 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 25 50 75 100 125 150 relative luminous flux junction temperature (oc) copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
5 electrical characteristics (t j = 25 c) relative flux vs. current (t j = 25 c) electrical characteristics (tj = 25oc) 0 100 200 300 400 500 600 700 800 900 1000 2.00 2.25 2.50 2.75 3.00 3.25 3.50 forward current (ma) forward voltage (v) typical spatial radiation pattern 0% 50% 100% 150% 200% 250% 0 100 200 300 400 500 600 700 800 900 1000 relative luminous flux (%) forward current (ma) 5 copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
6 relative chromaticity vs. current (warm white) relative chromaticity vs. temperature (warm white) warm white 150 200 300 350 500 700 1000 - 0.020 - 0.015 - 0.010 - 0.005 0.000 0.005 0.010 0.015 0.020 100 200 300 400 500 600 700 800 900 1000 current (ma) ccx ccy - 0.020 - 0.015 - 0.010 - 0.005 0.000 0.005 0.010 0.015 0.020 25 50 75 100 125 150 tsp ( c) ccx ccy warm white 150 200 300 350 500 700 1000 - 0.020 - 0.015 - 0.010 - 0.005 0.000 0.005 0.010 0.015 0.020 100 200 300 400 500 600 700 800 900 1000 current (ma) ccx ccy - 0.020 - 0.015 - 0.010 - 0.005 0.000 0.005 0.010 0.015 0.020 25 50 75 100 125 150 tsp ( c) ccx ccy 6 copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
7 typical spatial distribution thermal design the maximum forward current is determined by the thermal resistance between the l e d junction and ambient. it is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optomize lamp life and optical characteristics. 0 20 40 60 80 100 120 - 100 - 80 - 60 - 40 - 20 0 20 40 60 80 100 relative luminous intensity (%) angle (o) 0 200 400 600 800 1000 1200 0 20 40 60 80 100 120 140 maximum current (ma) ambient temperature (oc) rj- a = 10 c/w rj - a = 15 c/w rj - a = 20 c/w rj- a = 25 c/w copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
8 8 reflow soldering characteristics in testing, cree has found xlamp xp-e leds to be compatible with jedec j-std-020c, using the parameters listed below. a s a general guideline, cree recommends that users follow the recommended soldering profle provided by the manufacturer of solder paste used. note that this general guideline may not apply to all pcb designs and confgurations of refow soldering equipment. profle feature lead-based solder lead-free solder average ramp-up rate (ts max to tp) 3 c/second max. 3 c/second max. preheat: temperature min (ts min ) 100 c 150 c preheat: temperature max (ts max ) 150 c 200 c preheat: time (ts min to ts max ) 60-120 seconds 60-180 seconds time maintained above: temperature (t l ) 183 c 217 c time maintained above: time (t l ) 60-150 seconds 60-150 seconds peak/classifcation temperature (tp) 215 c 260 c time within 5 c of a ctual peak temperature (tp) 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package, measured on the package body surface. copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
9 9 notes lumen maintenance projections cree now uses standardized i e s lm-80-08 and tm-21-11 methods for collecting long-term data and extrapolating led lumen maintenance. for information on the specifc l m -80 data sets available for this led, refer to the public lm-80 results document at www.cree.com/xlamp_app_notes/lm80_results. cree currently recommends a maximum drive current of 700 ma for xlamp xp-e high effciency white in designs seeking the energy st a r* 35,000-hour lifetime rating ( 94.1% luminous fux @ 6000 hours) or 1000-m a driver current in designs seeking the energy st a r* 25,000-hour lifetime rating ( 91.8% luminous fux @ 6000 hours). please read the xlamp long-term lumen maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on crees lumen maintenance testing and forecasting. please read the xlamp thermal management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the l e d junction temperature. * these lifetime ratings are based on the current energy st a r product specifcation for luminaires (light fixtures) v 1.0 (february 16, 2011) and ene rgy star program requirements for integral le d lamps v 1.4 (may 13, 2011) lumen maintenance criteria. moisture sensitivity in testing, cree has found xlamp xp-e leds to have unlimited foor life in conditions 30 oc/85% relative humidity (rh). m oisture testing included a 168-hour soak at 85 oc/85% rh followed by 3 refow cycles, with visual and electrical inspections at each stage. cree recommends keeping xlamp l e ds in their sealed moisture-barrier packaging until immediately prior to use. cree also recommends returning any unused l e ds to the resealable moisture-barrier bag and closing the bag immediately after use. rohs compliance the levels of rohs restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eu directive 2011/65/ec (rohs2), as amended through june 8, 2011. rohs declarations for this product can be obtain from your cree representative or obtained from the product e cology section of www.cree.com. re a ch compliance re ach substances of high concern (sv hcs) information is available for this product. since the e uropean chemical agency ( e cha) has published notices of their intent to frequently revise the sv hc listing for the foreseeable future, please contact a cree representative to insure you get the most up-to-date r e ach declaration. historical reach banned substance information (substances restricted or banned in the e u prior to 2010) is also available upon request. copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
10 ul recognized component level 4 enclosure consideration. the led package or a portion thereof has been investigated as a fre and electrical enclosure per ansi/ul 8750. v ision a dvisory claim w a rning: do not look at exposed lamp in operation. eye injury can result. see led eye safety at www.cree.com/ xlamp_app_notes/led_eye_safety. copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
11 11 mechanical dimensions (t a = 25 c) all measurements are .13 mm unless otherwise indicated. size title of rev. sheet c drawing no. date date date check final protective finish material approved drawn by third angle projection scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d phone (919) 313-5300 fax (919) 313-5558 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice x .5 .xxx .25 .xx .75 .x 1.5 for sheet metal parts only .xx .25 .xxx .125 x .5 unless otherwise specified dimensions are in millimeters and after finish. tolerance unless specified: surface finish: 1.6 .98 .98 1.30 .65 .50 2.30 3.30 1.15 3.450 3.450 1.725 +/-.100 1.725 +/-.100 2.5 2.08 .83 .650 .50 .50 .40 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 1 / 1 24.000 a 2610-00014 outline drawing xp hew -- -- -- -- -- -- 11/29/10 d. cronin revisons rev description by date app'd recommended pcb solder pad recommended stencil pattern (hatched area is opening) size title of rev. sheet c drawing no. date date date check final protective finish material approved drawn by third angle projection scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d phone (919) 313-5300 fax (919) 313-5558 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice x .5 .xxx .25 .xx .75 .x 1.5 for sheet metal parts only .xx .25 .xxx .125 x .5 unless otherwise specified dimensions are in millimeters and after finish. tolerance unless specified: surface finish: 1.6 .98 .98 1.30 .65 .50 2.30 3.30 1.15 3.450 3.450 1.725 +/-.100 1.725 +/-.100 2.5 2.08 .83 .650 .50 .50 .40 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 1 / 1 24.000 a 2610-00014 outline drawing xp hew -- -- -- -- -- -- 11/29/10 d. cronin revisons rev description by date app'd recommended pcb solder pad recommended stencil pattern (hatched area is opening) size title of rev. sheet c drawing no. date date date check final protective finish material approved drawn by third angle projection scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d phone (919) 313-5300 fax (919) 313-5558 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice x .5 .xxx .25 .xx .75 .x 1.5 for sheet metal parts only .xx .25 .xxx .125 x .5 unless otherwise specified dimensions are in millimeters and after finish. tolerance unless specified: surface finish: 1.6 1.30 .65 .50 2.30 3.30 1.15 3.450 3.450 2.36 .83 .650 r 1.530 .50 .50 .40 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 1 / 1 24.000 b 2610-00015 outline drawing xp hew -- -- -- -- -- -- 3/8/11 d. cronin revisons rev description by date app'd b removed chip dimensions dc 5/11/11 recommended pcb solder pad recommended stencil pattern (hatched area is opening) anode copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
12 12 tape and reel all cree carrier tapes conform to e ia-481d, automated component handling systems standard. all dimensions in mm. loaded pockets (1,000 lamps) leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) start end cathode side anode side (denoted by + and circle) 160.0 a a b 2.5 .1 section a-a scale 2 : 1 1.5 .1 8.0 .1 4.0 .1 1.75 .10 12.0 .0 + .3 detail b scale 2 : 1 13 mm 7" cover tape pocket tape user feed direction user feed direction y y x x ref 0.59 w f(iii) p1 d1 1.5 min. bo ao r 0.2 typical ref 4.375 ko other material available. (iv) (iii) (ii) (i) hole to centerline of pocket. measured from centerline of sprocket holes is 0.20. cumulative tolerance of 10 sprocket to centerline of pocket. measured from centerline of sprocket hole section y-y section x-x 2.0 0.05 (i) p2 1.55 0.05 do 4.0 0.1 (ii) po 1.75 0.1 e1 0.30 0.05 t ref r 2.24 2.40 ko +0.0/-0.1 3.70 1 w f p +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 ao 3.70 +/- 0.1 bo +/- 0.1 y y x x ref 0.59 w f(iii) p1 d1 1.5 min. bo ao r 0.2 typical ref 4.375 ko other material available. (iv) (iii) (ii) (i) hole to centerline of pocket. measured from centerline of sprocket holes is 0.20. cumulative tolerance of 10 sprocket to centerline of pocket. measured from centerline of sprocket hole section y-y section x-x 2.0 0.05 (i) p2 1.55 0.05 do 4.0 0.1 (ii) po 1.75 0.1 e1 0.30 0.05 t ref r 2.24 2.40 ko +0.0/-0.1 3.70 1 w f p +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 ao 3.70 +/- 0.1 bo +/- 0.1 y y x x ref 0.59 w f(iii) p1 d1 1.5 min. bo ao r 0.2 typical ref 4.375 ko other material available. (iv) (iii) (ii) (i) hole to centerline of pocket. measured from centerline of sprocket holes is 0.20. cumulative tolerance of 10 sprocket to centerline of pocket. measured from centerline of sprocket hole section y-y section x-x 2.0 0.05 (i) p2 1.55 0.05 do 4.0 0.1 (ii) po 1.75 0.1 e1 0.30 0.05 t ref r 2.24 2.40 ko +0.0/-0.1 3.70 1 w f p +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 ao 3.70 +/- 0.1 bo +/- 0.1 ca thode side anode side copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds
13 packaging 13 patent label (on bottom of box) label with cree bin code, qty, reel id label with cree bin code, qty, reel id label with cree order code, qty, reel id, po # label with cree order code, qty, reel id, po # label with cree bin code, qty, reel id unpackaged reel packaged reel boxed reel cree bin code & barcode label vacuum-sealed moisture barrier bag label with customer p/n, qty, lot #, po # label with cree bin code, q t y , lot # label with cree bin code, q t y , lot # v acuum - sealed moisture barrier bag p atent label label with customer order code, q t y , r eel i d , po # copyright ? 2010-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo and xlamp ? are registered trademarks of cree, inc. xlamp xp-e high-efficiency white leds

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